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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

 

E-H Wong

E-bok 

1800,-

 

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

 

E-H Wong

Innbundet 

2925,-

 

Ny!

Science and Engineering of Short Fibre-Reinforced Polymer Composites

 

Shao-yun Fu

E-bok 

2925,-

 

Serie: Woodhead Publishing Series in Composites Science and Engineering