Reflow Soldering
Apparatus and Heat Transfer Processes
Balazs Illes ; Oliver Krammer ; Attila Geczy
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of
the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. Les mer
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2396,-
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Leveringstid: Sendes innen 21 dager
På grunn av Brexit-tilpasninger og tiltak for å begrense covid-19 kan det dessverre oppstå forsinket levering
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of
the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed
by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each
of these chapters includes a discussion of the physical background, structure and working principle, and characterization
of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder
failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will
be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing
industries.